India's Largest Database on New Projects
General Mills seeks new heat protection technologies
17 March 2011: General Mills has published three requests on its open innovation platform for new food packaging and heat protection technologies.
The three requests are the latest to appear on the G-Win platform – an online network through which General Mills looks for new technologies from outside its own R&D team. The latest is a call for “next generation” packaging materials that can shield food from microwave energy. General Mills said metal foil overwraps on paperboard packaging are typically used for this purpose but it is on the lookout for new alternatives.
The second request is for a new technology that blocks conductive heat transfer between food product layers. The third request on G-Win is for edible materials with properties that reflect microwave radiation rather than transmit or absorb it.
Source: Foodmanufacture