India is set to accelerate its semiconductor mission with plans to shift from 28-nanometre fabs to advanced 5-7 nanometre chip manufacturing, said Abhishek Singh, Additional Secretary, Ministry of Electronics and Information Technology.

Minister Singh emphasised progress in setting up assembly, testing, marking, and packaging (ATMP) plants alongside fabs, with industry majors like Tata playing a key role. Projects are already underway in Gujarat, Assam, and Odisha, strengthening India’s domestic capacity. While 28-nanometre plants mark the initial phase, the aim is to rapidly scale up the technology ladder.

Advanced manufacturing reflects the government’s focus on high-value chipmaking. The upcoming phase, termed "Semiconductor 2.0," along with design-led incentive schemes, is expected to push India further along the global semiconductor value chain and help establish a robust ecosystem for advanced electronics manufacturing.