Intel CEO Lip-Bu Tan is expected to visit Odisha later this year for the ground-breaking of 3D Glass Solutions’ (3DGS) semiconductor packaging plant, a senior state official said. 

Odisha Electronics and IT Department Principal Secretary Vishal Kumar Dev confirmed that the ceremony will be scheduled once th CEO finalises his visit. The project, to be executed by Heterogeneous Integration Packaging Solutions —backed by Intel, Lockheed Martin and Applied Materials, will involve an investment of Rs 1,943 crore with an annual capacity of five crore units.

Alongside, SicSem, in collaboration with UK-based Clas-SiC Wafer Fab, will break ground next month on the country’s first integrated silicon carbide (SiC) fab at InfoValley, Bhubaneswar, with production targeted in two years. Separately, RIR Power Electronics’ Rs 618 crore SiC wafer fabrication unit aims for commercial output by March 2026.

The Odisha government has revised its semiconductor policy, matching 50 percent of Central incentives and offering Rs 10,000 support for engineering students pursuing semiconductor studies. Two new electronics manufacturing pacts worth Rs 2,655 crore have also been signed.