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Application invited for Round-2 of large-scale electronics manufacturing under PLI Scheme

Monday, 15 Mar 2021
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The Ministry of Electronics and Information Technology (MeitY) has started inviting applications for the second round of large-scale electronics manufacturing under the Production-Linked Incentive (PLI) Scheme with focus on some electronic components such as motherboards, semiconductor devices, among others. 
 
The application window for the Scheme has been opened till 31 March 2021 which may be further extended. 
 
The tenure of the second round of PLI Scheme is for four years and the incentive will be applicable from 1 April 2021. 
 
The first round of the Scheme was open for receiving applications till 31 July 2020 which attracted participation from global majors such as Apple's contract manufacturers Foxconn, Wistron and Pegatron; Samsung; local players Lava, Optiemus, Dixon, etc committing investment of over Rs 11,000 crore. 
 
The first round targeted mobile manufacturing with incentives for 20 companies, while the second round has expanded the window for up to 30 eligible companies.
 
The new guidelines have identified components, discrete semiconductor devices including transistors, diodes, etc, passive components including resistors, capacitors, printed circuit board, assembly, assembly, testing, marketing and packaging (ATMP) units, etc as target segment for the second round of PLI. 
 
While companies whose projects were approved in the first round of PLI Scheme cannot participate in the second round, their group companies having minority or non-controlling interest in the applicant companies will be allowed to apply for incentives.
 
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