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EC grants extension to HSMC Tech for documents submission

Thursday, 24 Nov 2016
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The Empowered Committee (EC) has granted the consortium led by HSMC Technologies, further time to submit all documents for construction of a semiconductor wafer fabrication manufacturing facility, in the state of Gujarat.

HSMC Technologies, along with Silterra Malaysia Sdn Bhd and ST Microelectronics as partners, has proposed to develop a semiconductor wafer fabrication (FAB) manufacturing unit.

The consortium, led by Jaiprakash Associates and HSMC Technologies, was issued Letters of Intent (LoI) on 19 March, 2014, for the FAB projects. However, in March 2016, the consortium withdrew from the project.

The consortium has been putting in efforts to attract equity and debt funding to develop the facility.

 

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