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Sahasra to set up semiconductor packaging unit with Rs 350 cr outlay

Tuesday, 12 Dec 2023
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Noida-based Sahasra Electronics is planning to invest around Rs 350 crore in the next three years to set up a semiconductor packaging facility and increase manufacturing under the ‘Make in India’ program.

The new facility will come up at Bhiwadi in Rajasthan, where it has a semiconductor plant, for semiconductor packaging. The company will be investing in machines for the electronic assembly, thus, investment in the plant will be an excess of Rs 150 crore, and the building interior will involve about Rs 50 crore.

Sahasra Group's Sahasra Semiconductors (SSPL) has become one of the first Indian companies to start packaging and testing NAND flash memory in this financial year as well as first company to receive a production linked incentive (PLI ) scheme in 2020. NAND flash memory is a non-volatile storage technology that retains data without power.

Last month, Saharsa Electronics partnered with French Thomson Computing to streamline the latter's manufacturing in India to produce a range of laptops and tablets to cater to the increasing demands. In addition, the company maintains a partnership with a Taiwanese company for memory drives.

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