Hindalco Industries will invest Rs 586 crore to set up an integrated aluminium extrusion facility in Kuppam, Andhra Pradesh, focused on producing chassis for Apple’s iPhone.

The project, coming under the AP Electronics Component Manufacturing Policy 2025-30, is expected to create 613 work roles within four years and commence commercial production by March 2027. It will be considered for approval by the State Investment Promotion Board (SIPB). Officials highlighted that Kuppam’s location—closer to Bengaluru airport than the city itself and just 200 km from Chennai, makes it ideal for high-value manufacturing, leveraging both Bengaluru and Chennai’s infrastructure. 

"This is being done as it is not only the chief minister's constituency but also because it can tap into the infrastructure of both Bengaluru and Chennai," a senior official noted. The initiative aligns with Andhra Pradesh’s strategy to position Kuppam as a hub for the iPhone supply chain, especially with Foxconn already producing the iPhone 17 nearby. Alongside Hindalco, SIPB is also set to approve Syrma SGS Technology’s Rs 1,800-crore investment in PCB and CCL manufacturing.