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Tata Electronics, Bosch sign pact for semiconductor, chip packaging

Friday, 18 Jul 2025
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Tata Electronics has signed a memorandum of understanding (MoU) with German technology giant Robert Bosch to collaborate on critical areas in the electronics and semiconductor sectors.

The partnership will focus on chip packaging and manufacturing, leveraging Tata Electronics’ upcoming assembly and test unit in Assam and its semiconductor foundry in Gujarat. "This partnership is well-aligned with our commitment to help create a holistic semiconductor and electronics ecosystem in India, with offerings that resonate with customers around the world. Most importantly, our collaboration is yet another significant step towards creating a leadership position for the Indian electronics manufacturing sector on the global stage," said Randhir Thakur, CEO of Tata Electronics.

In addition to semiconductor initiatives, both companies will jointly identify and pursue local projects in electronic manufacturing services (EMS) for vehicle electronics, aiming to enhance capabilities in the automotive electronics space. "Bosch recognises the increasing demand for advanced automotive electronics and their critical role in shaping the future of mobility. To address the growing needs and foster supply chain resilience, Bosch is pleased to foster partnership with Tata Electronics," said Dirk Kress, Executive Vice President, Semiconductor Operations, Bosch.

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