Prime Minister Narendra Modi-led Union Cabinet has approved four new semiconductor projects under the India Semiconductor Mission (ISM), with a cumulative investment of around Rs 4,600 crore.

This marks a major boost to India’s semiconductor ecosystem, now comprising 10 ISM-approved projects worth Rs 1.60 lakh crore across six states. The new ventures include SiCSem and 3D Glass Solutions in Bhubaneshwar, Odisha, Continental Device India (CDIL) in Mohali, Punjab, and Advanced System in Package Technologies (ASIP) in Andhra Pradesh.

SiCSem, in collaboration with UK’s Clas-SiC Wafer Fab, will set up India’s first commercial compound semiconductor fab, producing 60,000 wafers annually. 3D Glass Solutions will establish a cutting-edge glass-based substrate and packaging unit. ASIP, partnering with South Korea’s APACT, will manufacture 96 million units annually for electronics applications.

CDIL will expand its discrete semiconductor production, targeting 158.38 million units per year. Together, these facilities will generate 2,034 skilled work roles, strengthen chip design capabilities, and support sectors like defence, EVs, AI, telecom, and renewable energy.