HCL Technologies expects to double its semiconductor services business in the next three to four years by building capabilities to manage end-to-end service in electronic production.
HCL Group is planning to set up a chip wafer fabrication unit for 65 nanometre nodes that are used in automobile, consumer durables and low-cost devices segment. The plant will be built in about 18-24 months from the date the government approves its application.
HCL Technologies currently partners with semiconductor players like Intel, NXP and TSMC.
The IT company has already started building capabilities in Brazil, Vietnam, Israel, the Netherlands and Japan, even as it continues to grow manpower in its Bengaluru office with diverse skill sets to cater to multiple clients.