The Government of Odisha has signed memoranda of understanding (MoUs) with three entities to develop an ecosystem for the manufacturing of semiconductors, on 02 November, 2023. The state government inked MoUs with the India Electronic and Semiconductor Association (IESA), Synopsys and Electronics, and the Computer Software Export Promotion Council (ESC).

In this agreement, IESA will facilitate the state government in developing capacity-building programmes and promoting the semiconductor ecosystem through events and conceptualisation of knowledge materials.

Synopsys will involve collaboration in areas such as the O-Chip programme, talent transformation, workforce development, readiness assessment of the state in semiconductors and the very large-scale integration (VLSI) domains, and internship and placement assistance to students of the state's engineering institutions. Further, ESC will promote electronics and IT/ITeS exports from the country.

The government has successfully hosted Odisha4Silicon-2023, a pioneering initiative to set up a robust semiconductor ecosystem in the region. In the event, the also launched of the pan-India Design Challenge under O-Chip organised by Electropreneur Park, Bhubaneswar.

Besides MoUs, there are other initiatives, like the launching of the IESA Odisha Chapter, and the Campus Connect Programme, with the aim to foster innovation, skill development, and industry-academia collaborations in the state. The Odisha4Silicon-2023 will enable the state to create a vibrant semiconductor ecosystem, drive innovation, and economic growth and generate employment opportunities for people.

The state Electronics and IT Minister stated Odisha has notified its 'Semiconductor Manufacturing and Fabless Policy 2023', offering the most competitive and comprehensive bouquet of incentives to investors. The state has also launched the Odisha Semiconductor Fab and Fabless Innovation and Acceleration Programme (O-Chip) to catalyse the development of an ecosystem in the state.