US semiconductor company Synaptics, provider of touch and display interfaces and connectivity devices, plans to assemble and package at least 10 percent of its chips in India starting from 2027.

President and CEO of Synaptics, Michael Hurlston has announced the company's concrete plans to diversify its supply chain, by assembling chips in Hyderabad. These chips, specifically quad flat packs with leads, will be manufactured in partnership with a vendor. This initiative aligns with a joint venture between Advanced System in Package Technologies (ASIP) and South Korea’s APACT, which is establishing an outsourced semiconductor assembly and test (OSAT) facility in Hyderabad. The facility is expected to be operational by late 2025 or early 2026, contingent on its readiness and the successful completion of qualification tests.

Additionally, Synaptics has partnered with US and Chennai-based embedded software engineering firm embedUR to develop edge-based artificial intelligence (edge AI) solutions. These solutions aim to integrate AI models directly into chips for smart devices. The partnership focuses on applications such as image segmentation, facial identification, and pose estimation, with targeted use cases include smart home devices, driver assistance systems, medical monitoring, and industrial manufacturing.

Synaptics' dual strategy of diversifying its supply chain and advancing AI capabilities highlights its efforts to adapt to changing global dynamics and enhance technological offerings.